Comparison of Microwave PCB Bonding Methods: What Designers Need to Know.

There are three methods commonly used for bonding multiple layers of RF & Microwave PCB laminates, such as PTFE (Teflon) materials, duroids and other RF materials from AGC Nelco,  Isola and Rogers. These three methods are 1. Thermoplastic films, 2. Thermoset prepregs, and 3. Direct bonding often called “fusion bonding”.